Boise, Idaho, October 23, 2025- Micron Technology has unveiled the SOCAMM2, the industry’s highest-capacity low-power memory module, designed to meet the surging demands of modern AI-driven data centers. The new LPDDR5X module promises 50% more memory capacity than previous generations while improving energy efficiency by more than 20%, all in the same compact form factor.
Built on Micron’s advanced 1-gamma DRAM process, the SOCAMM2 achieves higher memory densities, enabling servers to handle larger AI models, complex workloads, and faster data transfers without consuming excessive power. According to Micron, this low-power approach can help data centers reduce both operational costs and environmental footprint, a key consideration as hyperscale facilities expand globally.
The SOCAMM2 is tailored for system-on-chip (SoC) configurations, which are increasingly common in AI and high-performance computing environments. By integrating memory more closely with processing cores, data centers can achieve lower latency and faster throughput, essential for AI inference and training tasks.
“Data centers today are under immense pressure to deliver more computing power without proportionally increasing energy use,” said Micron spokesperson Jason Lin. “SOCAMM2 is our response: a memory module that balances capacity, speed, and efficiency, helping operators run next-gen workloads sustainably.”
Analysts note that as AI models scale, memory bottlenecks have become a key limiting factor. Modules like the SOCAMM2 allow servers to hold larger datasets in memory, reducing reliance on slower storage layers and improving overall system performance. This makes the module particularly attractive for cloud providers, AI labs, and enterprises running demanding simulations or analytics.
Beyond raw performance, the SOCAMM2’s low-power design aligns with broader industry trends toward energy-efficient computing. With data centers consuming an estimated 1-2% of global electricity, innovations that reduce power draw without sacrificing speed are increasingly valuable. Micron’s new module may also help operators meet sustainability targets and reduce cooling requirements, given lower heat generation.
Micron plans to start shipping SOCAMM2 modules to select partners and early adopters by early 2026, aiming to give hyperscale data centers and AI operators a head start in upgrading infrastructure for the next wave of computing demands.
In essence, the SOCAMM2 is not just a memory module; it’s a building block for faster, greener, and more capable AI-ready data centers, reflecting how memory innovation continues to shape the future of high-performance computing.
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