Singapore, September 30, 2025- Carrier introduced its QuantumLeap™ suite at Data Centre World Asia, showcasing next-generation thermal management solutions designed for high-density data centers and AI workloads.
The platform combines advanced liquid and air-cooling technologies, intelligent controls, and predictive maintenance to improve efficiency, scalability, and operational reliability. It is tailored to meet the demands of modern data centers, particularly those handling AI, HPC, and high-density server racks.
"Asia is at the center of the global data revolution, and Carrier is enabling its growth," said Arun Bhatia, Executive Managing Director - Southeast Asia, Carrier. "QuantumLeap combines advanced liquid and air cooling, intelligent controls, and predictive service into one integrated platform. From chip to chiller, we deliver the resilience, efficiency, and scalability that operators need to keep pace with AI, hyperscale, and sustainability demands."
Key features include chillers and air handling systems with low harmonic variable frequency drives (VFDs) and sustainable refrigerants, as well as direct-to-chip liquid cooling for GPU-intensive workloads. Carrier’s Abound™ digital platform enables predictive maintenance, helping operators minimize downtime and maximize uptime across their infrastructure.
Carrier said the QuantumLeap portfolio is aimed at addressing the rapidly growing Asian data center market, projected to reach $7.3 billion by 2031, driven by AI adoption and increasing demand for energy-efficient cooling solutions.
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