Pranav Hotkar
ABU DHABI, UAE - May 28, 2026 - Centamil has launched the Hayagreeva HEx, a direct-to-chip liquid cooling cold plate designed for next-generation AI data center infrastructure, as the industry faces rapidly rising thermal loads from increasingly power-hungry AI accelerators.
The company said the copper-matrix cold plate has been validated for continuous heat removal above 5,000 watts while maintaining a rated thermal resistance of 0.005 °C/W. The launch positions the product for upcoming generations of AI silicon expected to significantly exceed today’s cooling thresholds.
According to Centamil, AI accelerator power consumption has climbed from roughly 300W per chip three years ago to approximately 1,200W today, while semiconductor roadmaps point toward processors exceeding 4,400W within the next two years. The company argues that existing production cold plate technologies are struggling to keep pace with this escalation in thermal density.
The Hayagreeva HEx platform uses a copper-matrix wetted-surface architecture exceeding 4,000 square meters per cubic meter, designed to increase heat transfer efficiency while supporting ultra-high-density AI deployments. The system targets direct-to-chip liquid cooling environments across NVIDIA, AMD, and Intel accelerator platforms.
“AI silicon has been growing faster than the cooling sitting on top of it,” said Praveen Kumar Gorakavi, founder and CEO of Centamil. He added that the company developed the product specifically for future AI processors rather than current-generation hardware.
The launch reflects a broader industry shift toward liquid cooling as hyperscale AI infrastructure pushes beyond the practical limits of conventional air-cooled systems. Recent data center deployments across the AI sector have increasingly adopted direct-to-chip and immersion cooling technologies to manage rising rack densities and improve energy efficiency. Companies, including Fourier Cooling and MiTAC Computing, have also introduced liquid-cooled AI infrastructure platforms over the past year.
Centamil said the Hayagreeva HEx platform is protected by 14 patent filings covering thermal architecture, manufacturing methods, and system integration technologies. The company has opened a pilot evaluation program for qualified data center operators, server OEMs, and integration partners. Production samples are expected to ship within four to six weeks following an executed letter of intent.
Founded as a deep-tech intellectual property company, Centamil is expanding its portfolio around AI-era infrastructure technologies, including thermal management systems and AI-embedded microreactor technologies. The Hayagreeva HEx marks the company’s first commercial product in the AI thermal management market.
