Rueil-Malmaison, France, September 29, 2025- Schneider Electric and its subsidiary Motivair unveiled their first joint liquid cooling portfolio, targeting hyperscale, colocation, and high-performance computing (HPC) data centers facing rising thermal demands.
The portfolio branded “Motivair by Schneider Electric” integrates Coolant Distribution Units (CDUs), Rear-Door Heat Exchangers, Heat Dissipation Units, dynamic cold plates, chillers, and end-to-end cooling loops designed for high-density racks ranging from 105 kW up to 2.5 MW. The suite is optimized for next-generation AI accelerators, GPUs, and HPC workloads, providing direct-to-chip thermal management and supporting extreme power densities exceeding 140 kW per rack.
Accompanied by Schneider Electric’s EcoStruxure software, the portfolio offers monitoring, predictive analytics, and operational efficiency tools to help data center operators manage energy usage and maximize cooling performance.
This launch follows Schneider Electric’s February 2025 acquisition of Motivair, which secured a controlling 75% stake. The move marks the first comprehensive release under the combined brand and addresses the growing demand for liquid cooling as traditional air-cooled infrastructure struggles with AI-driven power densities.
Industry observers note that liquid cooling can significantly reduce energy consumption, especially for high-density racks, where cooling can account for up to 40% of total data center power. Motivair is expanding its global manufacturing footprint, including facilities in the U.S., Italy, and India, to meet expected worldwide demand.
“With this portfolio, we provide operators with scalable, efficient, and reliable liquid cooling solutions for the next generation of high-density computing,” said Motivair CEO John T. Myers. “Our combined expertise ensures performance, energy efficiency, and rapid deployment at a global scale.”
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